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SP-1 Description:

The SP-1 is an in-line 100% 2D and sampled 3D solder paste inspection system designed for SMT manufacturers. The SP-1 provides highly accurate and repeatable measurements of stencil offset and skew, as well as solder paste area, height and volume. The

SP-1 was added in Jan 2001

SP-1 has been viewed 129 times

Conductive Adhesive & Non-Conductive Adhesive Dispensing

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