RMA258-15R Rosin Based Solder Paste
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RMA258-15R Rosin Based Solder Paste |
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RMA258-15R Rosin Based Solder Paste Description:
RMA258-15R is a rosin based solder paste that has been developed to offer long pause-to-print capabilities while enhancing fine print definitions.
RMA258-15R reduces such defects as voiding and eliminates head-in-pillow. The superior wetting ability of RMA258-15R results in bright, smooth and shiny solder joints. RMA258-15R is capable of exceptional reflow during long, hot profiles. RMA258-15R leaves medium, amber colored post process residues.
Features
- Long Pause-to-Print Capabilities
- Enhances Fine Print Definitions
- No Head-in-Pillow
- Excellent Wetting, Even with Leadless Devices
- Exceptional Reflow During Long, Hot Profiles
- Reduced Voiding
Printing:
- Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16 mm (½ to ⅝ inch) is normally sufficient to begin).
- Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties.
- RMA258-15R provides the necessary tack time and force for today’s high speed placement equipment, which will enhance product performance and reliability.
- Cleaning of your stencil will vary by application; however, it can be accomplished using AIM DJAW-10 stencil cleaner.
Cleaning:
- RMA258-15R is a rosin based formula that may be cleaned if necessary with saponified water or an appropriate solvent cleaner.
- Please refer to the AIM cleaner matrix for a list of compatible cleaning materials.
Handling and Storage:
- RMA258-15R is best used within 1 year at 4° C-12° C (40° F-55° F) or 6 months at room temperature.
- Allow the solder paste to warm up completely and naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
- Mix the product lightly and thoroughly (1-2 mins. max) to ensure even distribution of any separated material.
- Do not store new and used paste in the same container, and reseal any opened containers while not in use.
- Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.
Physical Properties:
Item: |
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Appearance |
Gray, Smooth, Creamy |
Alloy |
SAC305 |
Melting Point |
217° -218° C |
Particle Size |
T3 , T4, T5 |
Metal Loading |
89% (T3), 88.5% (T4, T5) |
Viscosity |
Print/dispense versions available. |
Packaging |
Available in all industry standard packaging. |
RMA258-15R Rosin Based Solder Paste was added in May 2012
RMA258-15R Rosin Based Solder Paste has been viewed 841 times
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