NC520 Lead-Free & Tin-Lead Solder Paste
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NC520 Lead-Free & Tin-Lead Solder Paste |
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NC520 Lead-Free & Tin-Lead Solder Paste Description:
For Use with Demanding High Density Electronic Assemblies.
NC520 is a general no clean paste for use with lead-free and tin/lead alloys . NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding.
- Reduced Head-in-Pillow
- Extremely Stable Formula
- Extended Pause-to-Print Process Window
- Reduces Voiding on QFN Ground Pads
- Improved Printing Characteristics
NC520 Lead-Free & Tin-Lead Solder Paste was added in May 2015
NC520 Lead-Free & Tin-Lead Solder Paste has been viewed 434 times
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