S3088 UFI - Reliable Underfill Inspection
S3088 UFI - Reliable Underfill Inspection Description:
The inspection system S3088 UFI was developed specifically for reliable, cost-effective defect detection and fast process optimization. A versatile inspection concept with scalable, modular camera technology enables dependable inspection of under fillings of BGAs, Flip Chips and other components - from prototypes up to large series.
By feeding electronic assemblies in and out at the same time, the Viscom FastFlow Handling ensures extremely short handling times down to a minimum of 2.5 seconds. Orthogonal cameras with a high resolution of up to 11.75 µm/ pixel guarantee consistently accurate detection even of critical defects, supported by optional side cameras with an 8 µm/pixel resolution.
Another intelligent feature of Viscom AOI is the integrated defect verification. This feature ensures full defect detection even as it improves first pass yield. This gives system operators a convenient tool to back up a zero-escape strategy. Powerful add-on modules like off-line programming and SPC evaluation further enhance this offer.
S3088 UFI Features:
- Extremely high throughput due to FastFlow Handling
- Revolutionary simplicity in AOI operation with vVision
- Scalable camera technology and switchable resolution (OnDemandHR)
- Best resolution at angled views
- Height measurement of components
- Reading DataMatrix code, bottom up
Worldwide service at the highest level
Experienced Viscom employees in Hanover and the international branch offices, as well as many international agents, support our customers worldwide. In Service alone, since 2009 a great number of flexible and highly trained employees were consolidated into a separate division. The offering includes routine servicing, troubleshooting, maintenance, calibration service and modernization, among others. Visit our website to find international subsidiaries and representatives in Europe, USA and Asia.
S3088 UFI - Reliable Underfill Inspection was added in Sep 2018
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