MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution Description:

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages.

MICRONOX® MX2302 has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.

MICRONOX® MX2302 Key Benefits:

• Cleans by Dissolution; Strong Kinetic Cleaning Forces
• Multi-Metal Safe
• Works on All Flux Residue Types; Including Pb-Free
• Brilliant Solder Joints
• Removes Baked on Flux from High Temperature Reflow

Processes:

• Semi-Aqueous Spray-Under-Immersion
• Ultrasonic
• Centrifugal

MICRONOX® MX2302 Applications:

• Defluxing Mixed Technology PCBs
• BGAs, µBGAs, and Chip Scale Packages
• B-SIde Mis-Prints

Soils:

• Water Soluble Flux
• Synthetic Flux
• FInger Print Oils
• RMA Flux
• Reaction Products
• Plasticizers from Flux
• No-Clean Flux
• Ionic Contaminants
• Organic Compounds
• Solder Balls
• Rheological Additives to Solder Pastes

Compatibility:

MICRONOX® MX2302 has proven compatible with all materials commonly used in electronic assembly, wafer bumping and advanced packaging manufacturing and cleaning processes. For specific compatibility information, please contact your Kyzen representative.

Environmental, Health And Safety:

MICRONOX® MX2302 is a biodegradable, non-flammable, non-corrosive solvent. It contains no CFC’s or HAP’s.

Availability:

MICRONOX® MX2302 is available in one (1) gallon, five (5) gallon and 55 gallon containers.

MICRONOX Product Line:

Semiconductor grade cleaning chemistries for defluxing and particulate removal for the Microelectronics and Semiconductor industries.