SMT Equipment

KYZEN® E5615 - Fast Drying Stencil Cleaner

Company Information:

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Nashville, Tennessee, USA


  • Phone 615-831-0888
  • Fax 615-831-0889

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KYZEN® E5615 - Fast Drying Stencil Cleaner

KYZEN® E5615 - Fast Drying Stencil Cleaner


KYZEN® E5615 - Fast Drying Stencil Cleaner


Cleaning Agents

Offered by:

KYZEN Corporation


KYZEN® E5615 - Fast Drying Stencil Cleaner Description:

KYZEN® E5615 is an aqueous based cleaner designed to be the fastest drying chemistry in the industry. E5615 is shipped ready to use and successfully removes unreflowed solder paste from stencils and related equipment.

  • Fast Drying
  • No Rinse Required
  • Low Cost of Ownership
  • Ships Ready to Use
  • Compatible with Standard Stencil Cleaning Equipment as well as Automated Under Stencil Wipe Applications

KYZEN E5615 is an engineered cleaning fluid designed to reduce stencil under wipe coefficient of variation and improve transfer efficiency. The process of depositing solder paste on a circuit board for SMT assembly is highly complex and critical to the success of the assembly line. Numerous factors such as solder paste formulation and stencil printer setup affect the process quality. External factors such as the environment, humidity, response to pause, operator skill level as well as lot-to-lot solder paste variation influence process consistency over time.

KYZEN E5615 is a pH neutral cleaning agent that has no flash point to boiling. This product is an ideal replacement for IPA (isopropyl alcohol). The product is effective on water soluble, rosin and many no-clean solder paste products. KYZEN E5615 contains no non-volatile ingredients within the formulation, and as such, requires no solvent or water rinsing.

KYZEN® E5615 - Fast Drying Stencil Cleaner was added in Aug 2015

KYZEN® E5615 - Fast Drying Stencil Cleaner has been viewed 1003 times

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