SMT Equipment

Indium Solder Pastes

Indium Solder Pastes

Indium Solder Pastes

Name:

Indium Solder Pastes

Category:

Solder Materials

Offered by:

Indium Corporation

Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

(9) products in the catalog

(24) technical library articles

(278) news releases

Indium Solder Pastes Description:

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for your application. Specialized pastes are available for printing, dipping, dispensing, and package-on-package (PoP) assembly.

Besides having a selection of over 220 alloys, Indium Corporation offers several flux types that encompass a variety of more fine-tuned formulations.

Below is a list of products, designed to give you the right mix of solder paste attributes for your process. If you have any question about the best type of solder powder or solder paste for your application, please feel free to contact us.

Product Name

Pb-Free

Halogen-Free

No-Clean

Water-Soluble

Key Attributes

BP-3106 BGA Bumping Solder Paste

X

Specifically formulated for BGA bumping applications

Indalloy 182 Gold-Tin Solder Paste

X

For applications that require a high melting temperature (over 150°C), good thermal fatigue properties and high temperature strength. Available in both no clean and RMA formulations

Indium10.1 Pb-Free Solder Paste

X

X

Low voiding on QFN, BGA, and CSP components, exceptional head-in-pillow resistance, eliminates the graping phenomenon

Indium9.72 Die Attach Solder Paste

Ultra-low voiding with minimal profiling, reliable miss-free, clog-free dispensing, consistent dispensing deposit level

Indium9.52 Die Attach Solder Paste

X

Low residue, reliable miss-free, clog-free dispensing, consistent deposit size

Indium9.0A Pb-Free Solder Paste

X

X

Eliminates graping phenomenon on small deposits, low voiding in BGA/CSP solder joints

Indium8.9 Pb-Free Solder Paste

X

X

Technology optimized for miniaturized electronics and HIP reduction

Indium8.9E Pb-Free Solder Paste

X

X

Best-in-class for small deposit print transfer efficiency and elimination of graping defects

Indium8.9HF Pb-Free Solder Paste

X

X

X

Ideal for head-in-pillow and graping elimination, excellent soldering performance under high temperature and long reflow processes

Indium8.9HF SnPb Solder Paste

X

Eliminates hot and cold slump, wets well to oxidized BGA and pad surfaces to eliminate head-in-pillow defects

Indium8.9HF-1 Pb-Free Solder Paste

X

X

X

Combines probe-testability with head-in-pillow elimination

Indium8.9HF1-P Pb-Free Solder Paste

X

X

X

Excellent soldering performance under high temperature and long reflow processes, excellent wetting

Indium8.9HF1-S3 Solder Paste

X

Unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium8.9HFA Pb-Free Solder Paste

X

X

X

Specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems

Indium6.8 Solder Paste

X

Ultra-low voiding, superior fine pitch soldering ability, wide humidity tolerance

Indium6.4 Water-Soluble Pb-Free Solder Paste

X

Lowest voiding water wash solder paste on the market.

Indium6.3 Water-Soluble Solder Paste

X

X

Water wash technology that possesses industry leading wetting properties

Indium6.2 Water-Soluble Solder Paste

X

Ultra-low voiding, superior fine pitch soldering ability, wide humidity tolerance

Indium5.8LS Pb-Free Solder Paste

X

X

Designed for maximum paste print transfer efficiency and elimination of flux spattering

Indium5.7LT Solder Paste

X

X

X

Low melting point solder paste with high reliability for use in temperature sensitive applications

Indium5.5LT Solder Past

X

X

X

Low temperature Pb-Free solution, formulated for use with the eutectic 58Bi/42Sn and 57Bi/42Sn/1Ag alloys

Indium5.1 Pb-Free Solder Paste

X

X

Industry leading response-to-pause performance, clear residue, low voiding

Indium5.1AT Pb-Free Solder Paste

X

X

Ultra-low voiding in BGA/CSP components, ultra-low voiding at via-in-pad sites, excellent micro BGA/CSP printability

Indium3.2 Pb-Free Water-Soluble Solder Paste

X

X

Technology for maximizing the process window with long stencil life and strong humidity resistance

Indium3.2HF Water-Soluble Solder Paste

X

X

X

Halogen-Free version of Indium3.2

Indium3.1 Pb-Free Water-Soluble Solder Paste

X

X

Exceptional printing, long stencil life, outstanding slump resistance, low voiding, low foam

Indium3.1AF Pb-Free Water-Soluble Solder Paste

X

X

Consistent fine-pitch printing performance with high transfer efficiency from stencil apertures, superior fine-pitch soldering ability

NC-SMQ230 Pb-Free Solder Paste

X

X

Minimum peak temperature 229°C, consistent fine pitch print deposition, excellent start-up after idle time

NC-SMQ92 Solder Paste

X

Consistent fine-pitch paste deposition, long stencil life and tack time, excellent wetting

NC-SMQ92H Solder Paste

X

Modified version of NC-SMQ92J that maximizes print performance.

NC-SMQ92J Solder Paste

X

X

Industry leading solder paste with a soft residue that reduces false failures at ICT.

NC-SMQ92J-UV Solder Paste

X

Probe-testable UV fluorescing, post reflow residue, strong initial tack strength and long-term stability

NC-SMQ90 Solder Paste

X

Formulated to yield accurate, repeatable dispensing performance on both pneumatic and positive displacement dispensing equipment

NC-SMQ81 Solder Paste

X

X

Designed for use with Sn/Bi and Sn/Bi/Ag alloys, exceptional wetting capabilities

NC-SMQ80 Solder Paste

X

Specialty solder paste for low temperature applications with high mechanical reliability

NC-SMQ®75 Solder Paste

X

X

Designed for reflow in a nitrogen atmosphere of 100-ppm oxygen or less.

NC-SMQ57 No-Clean Solder Paste

X

Low residue, accommodates low to high humidity conditions

NC-SMQ51SC Solder Paste

X

Superior tack strength, exceptional wetting in air reflow, consistent fi ne pitch print deposition

RMA-F Solder Paste

Outstanding slump resistance, excellent wetting compatibility

RMA-SMQ51A Solder Paste

RMA solder paste that meets no-clean requirements. Excellent soldering performance

RMA-SMQ51AC Solder Paste

X

Consistent fine pitch print deposition, superior tack strength

WMA-SMQ69HT High Temperature Water Soluble Solder Paste

X

Superior humidity and slump resistance, formulated for high temperature alloys

Indium Solder Pastes was added in Jan 2001

Indium Solder Pastes has been viewed 626 times

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