SACM™ Soldering Alloy
SACM™ Soldering Alloy Description:
Superior Drop Shock Performance AND Thermal Cycling Reliability
Current Industry Dilemma
The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to SnPb relative to drop test performance.
Indium Corporation has developed an alloy called SACM™. This alloy consists of 97.5–98.5% Sn, 0.5–1.0% Ag, 0.5–1.0% Cu, and dopant levels of Mn. SACM™ provides the optimal balance of drop test vs. thermal cycling and cost vs. reliability.
The invention of SACM™ offers superior drop shock performance versus SAC305 and SAC105, with the added benefit of thermal cycling reliability equivalent to SAC305. This provides manufacturers with an affordable high-reliability SAC alloy. This development is especially meaningful for the manufacture of consumer electronics that normally see frequent handling, such as mobile devices.
SACM™ is doped with manganese and contains less silver than other Pb-free alloys. Manganese provides increased strength and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
SACM™ Soldering Alloy Highlighs:
Ideal for miniaturized components and fine-pitch assembly
- Designed especially for CSP, 0201, and 01005 components
First-class printing performance
- Excellent print transfer through tiny apertures with area ratios <0.66
- Long stencil life and forgiving response-to-pause
- High component retention tack prevents components from shifting
Robust reflow performance
- Wide process window for flexible reflow profiling
- Optimal wetting to all common surface finishes
- Low voiding (<5%) for BGAs with via-in-pad technology
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for your application. Specialized pastes are available for printing, dipping, dispensing, and package-on-package (PoP) assembly.
SACM™ Soldering Alloy was added in Nov 2013
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