Indium6.4R Water-Soluble Pb-Free Solder Paste

Indium6.4R Water-Soluble Pb-Free Solder Paste Description:

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It excels in both SnPb and Pb-free assembly processes, providing an exceptional reflow process window. This solder paste delivers outstanding stencil printing performance, with long stencil life and excellent response-to-pause. Indium6.4R replaces Indium6.4, our former top water-soluble solder paste.

Indium6.4R provides superior wetting to a variety of surface finishes and exhibits the best voiding performance: fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs and BTCs (QFNs, D-Paks, LGAs, etc.)

Features:

• Lowest voiding water-soluble flux for solder paste:
  • Reduced largest voids
  • Fewer voids
  • Minimized voiding overall
  • For BGA, CSP, and bottom termination components such as QFNs
• Exceptional printing process window:
  • Excellent response to pause
  • Long stencil life (>8 hours in controlled environment)
  • Prints consistently at a wide range of speeds
• Wide reflow process window for profiling
• Excellent wetting on a variety of surface finishes
• Maintains tack over time
• Suitable for SnPb eutectic alloys as well as Pb-free alloys