VisionPro AP500 - Automated 3D SPI
VisionPro AP500 - Automated 3D SPI Description:
Automated Benchtop 3D Measurement & Analysis.
VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features. VisionPro AP500’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.
- Multiple Sensor Options: SP3D & SPI Models
- Fully Automated Height/Volume Measurements
- Both Gerber Programming & Auto-Scripting
- Defect Error Review
- Built-in Data and SPC Charting
- Color 3D Profiles of Measured Features
- ASCan Ultra Measurement Software
- Windows Operating System
- Dell® PC and LCD Monitor
- Large Work Surface
- NIST Traceable Standard
- Hardware/Software Reference and Online Help
VisionPro AP Series
The VisionPro AP Series of solder paste inspection solutions incorporates high-resolution PCB positioning with sophisticated, 3D measurement technology to provide the most accurate and repeatable SPI system available. Real-time quantitative analysis and true 3D qualitative imaging are just a few of the key features the VisionPro AP Series has to offer.
VisionPro AP500 - Automated 3D SPI was added in Nov 2001
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