VisionPro HSi High Speed Offline 3D SPI

VisionPro HSi High Speed Offline 3D SPI Description:

VisionPro HSi is high speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features. VisionPro's completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

Features:

• Fully Automated Solder Paste Height/Volume Measurements
• Color 3D Profiles of Measured Features
• Windows® XP Pro / Windows 7 OS
• One-Year, End-User Warranty with Technical Support

Includes:

• VisionPro 3D Camera Assembly
• Dell® PC and LCD  Monitor
• Large 14" x 18" Inspection Area
• NIST Traceable Standard
• Hardware/Software Reference and Online Help