VisionPro AP212 3D SPI
VisionPro AP212 3D SPI Description:
VisionPro AP212 is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features. VisionPro's completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.
- Measure Height, Area,Volume
- 3D Qualitative Analysis
- Windows® XP / 7 OS
- One-Year, End-User Warranty
- VisionPro 3D Sensor
- Dell® PC and LCD Monitor
- Large Work Surface
- NIST Traceable Standard
- Hardware/Software Reference
VisionPro AP SeriesThe VisionPro AP Series of solder paste inspection solutions incorporates high-resolution PCB positioning with sophisticated, 3D measurement technology to provide the most accurate and repeatable SPI system available. Real-time quantitative analysis and true 3D qualitative imaging are just a few of the key features the VisionPro AP Series has to offer.
VisionPro AP212 3D SPI was added in Jun 2015
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