Chip Process Inc.

Lead Conditioning, Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing Services

Tape and Reel Services, Service Provider

Semiconductor finishing services which include Lead Conditioning (repair), Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing, Device Reclaim from Board Services. Also can be included under Lead Straightening and Lead Inspection category.

Device Reclaim from Board, BGA Reballing.

Voidless Reflow Soldering

Compact Automatic Pick and Place