Samsung Electronics

For over 70 years, Samsung has been dedicated to making a better world through diverse businesses. Our flagship company, Samsung Electronics, leads the global market in high-tech electronics manufacturing and digital media.


Samsung Electronics Co., Ltd. engages in the manufacture and sale of electronic products. The firm operates through the following business divisions: Consumer Electronics (CE), Information Technology & Mobile Communications (IM), and Device Solutions (DS). The CE business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines, and medical devices. The IM business division offers handheld products, communication systems, computers, and digital cameras. The DS business division comprises of memory, system large scale integrated circuit, and light emitting diode. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

Samsung Electronics Postings

1 technical article »

Effects of Package Warpage on Head-in-Pillow Defect

Jul 06, 2017 | Zhenyu Zhao1, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University, Chang Yong Park - Samsung Electronics

Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments....

10 news releases »

Samsung Files Patent Infringement Suit Against SanDisk

Mar 12, 2002 | Samsung Electronics has filed a patent infringement lawsuit against SanDisk Corp. over several patents related to flash data storage.

Samsung Reorganizes Semiconductor Group

Mar 07, 2002 | Samsung Electronics is reorganizing its Semiconductor business group under a new name, Device Solution Network, to give more autonomy to its three main units in memory, telecommunications chips, and LCD panels, accordingto some financial analysts in Korea Tuesday

Samsung Calls Infineon Charges 'nonsense'

Nov 28, 2001 | Samsung Electronics rejected on Tuesday comments by Germany's Infineon Technologies AG that suggested the world's top memory chip maker had helped drive down chip prices to pressure smaller players.

Samsung Volume Production In 300mm Wafer Fab

Oct 30, 2001 | Hoping to extend its lead in DRAMs and other chip products, South Korea's Samsung Electronics Co. Ltd. here today announced that it has begun mass production in its initial 300-mm wafer fab.

Korea's Samsung Electronics Boosts Marketing Budget

Aug 21, 2001 | South Korea's largest electronics firm, Samsung Electronics, has raised its marketing budget this year by 20 percent to $940 million as it strives for brand promotion to counter slowing global demand, a company executive said on Tuesday.

SAMSUNG Develops Low-Power 8Mb SRAM/64Mb NAND Flash Stacked MCP Memory Device

Aug 10, 2001 | SAMSUNG has shipped the first engineering samples of a MCP device integrating 64Mb NAND-type flash memory and 8Mb SRAM. * Cost#ffective optimal solution for 3G mobile phones. * Mass production set for the second quarter of 2001.

Samsung Sees DRAM Supply-Demand Imbalance Until Q4

Jul 20, 2001 | South Korea's Samsung Electronics said on Friday it expects demand in dynamic random access memory (DRAM) chips to stay below supply until the fourth quarter of the year.

SAMSUNG Licenses ARM Microprocessor Cores - Agreement Enables Samsung To Target 800 MHz Standard Products

Jul 16, 2001 | ARM and Samsung today announced that Samsung has licensed the ARM926EJ-S(TM), the ARM946E(TM) and the ARM1020E(TM) microprocessor cores for use in its system-on-chip (SoC) devices.

Samsung Electronics Gets Behind QDR Standard

Apr 05, 2001 | Samsung Electronics, one of the world's largest manufacturers of memory chips, has announced backing for the QDR (quad data rate) high-speed memory chip standard and joined the team of four companies developing the technology.

Korea's Samsung Elec To Cut 2001 Chip Capex-Report

Mar 29, 2001 | South Korea's major chipmaker Samsung Electronics (05930) has decided to cut its 2001 capital expenditure by one trillion won ($769.2 million) because of a slowdown in the global chip market, a local newspaper reported.

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