Rockwell Collins

Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications.

Manufacturer of Assembled PCBs, Other

Our expertise in flight-deck avionics, cabin electronics, mission communications, information management and simulation and training is strengthened by our global service and support network spanning 27 countries. Working together, our global team of nearly 20,000 employees shares a vision to create the most trusted source of communication and aviation electronics solutions.

Our aviation electronics systems and products are installed in the flight decks of nearly every air transport aircraft in the world. Our airborne and ground-based communication systems transmit nearly 70 percent of all U.S. and allied military communication. Whether developing new technology to enable network-centric operations for the military, delivering integrated electronic solutions for new commercial aircraft or providing a level of service and support that increases reliability and lowers operational costs for our customers throughout the world, we deliver on our commitments.

Rockwell Collins Postings

3 technical articles »

The Last Will And Testament of the BGA Void

Jan 05, 2015 | Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins, Dr. David Bernard, John Travis, Dr. Evstatin Krastev, Vineeth Bastin - Nordson Dage.

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products.

This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis....

An Investigation of Whisker Growth on Tin Coated Wire and Braid

Aug 02, 2012 | Dave Hillman, Tim Pearson, Thomas Lesniewski

First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o...

The Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity.

Apr 29, 2008 | David Hillman, Matt Wells, Kim Cho

The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies...

ADJUST-A-VAC Vacuum Tweezer for fragile components, wafers, MEMS devices tweezers

Flying Probe Probe Tester with AOI