SMT Equipment

Underfill Encapsulants for Flip Chips

Underfill Encapsulants for Flip Chips

Underfill Encapsulants for Flip Chips

Name:

Underfill Encapsulants for Flip Chips

Category:

Materials

Offered by:

Zymet, Inc

Company Information:

Zymet, Inc

Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.

E. Hanover, New Jersey, USA

Adhesives/Dispensing, Manufacturer of Assembly Material, Repair/Rework

  • Phone (973)428-5245
  • Fax (973)428-5244

Zymet, Inc website

Company Postings:

(8) products in the catalog

(7) news releases

Underfill Encapsulants for Flip Chips Description:

Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to achieve the fast, void free encapsulation.

Features include:

  • Flow into gaps as fine as 18 microns
  • Fast inline cure, or longer conventional oven cure
  • CTE's ranging from 23 ppm/ºC to 40 ppm/ºC
  • Excellent adhesion to organic substrates and to die passivations
  • Excellent fracture toughness to resist cracks and crack propagation

Underfill Encapsulants for Flip Chips was added in Oct 2013

Underfill Encapsulants for Flip Chips has been viewed 56 times

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