BGA Rework Services
BGA Rework Services Description:Process Sciences specializes in the rework of BGA, LGA and QFN devices, BGA connectors, and various styles of bottom terminated SMDs. Driven by customer demands in the early 1990's, PSI developed custom convection air rework solutions for BGA devices, and continues to be a pioneer in the challenging field of BGA rework.
Because of our strong reputation and long history of resolving rework challenges, PSI is often asked to handle problematic materials and challenging applications, or to repair work done by others. In particular, PSI has experience overcoming severe deflection in circuit boards, part warpage, heavy copper ground planes, massive (>2500 i/o) BGAs, flexible circuit boards, interposers, and more.
Our ARTStation convection air rework systems were conceptualized and designed internally, and manufactured exclusively for PSI. With bottomside heater capable of delievering 8kW power, flexible fixturing options, and an assortment of custom nozzles, these systems can handle virtually any size assembly, from large test platform boards to tiny mobile electronics. They are part of what allows PSI to remain agile in exceeding client expectations.
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BGA Rework Services was added in Jun 2015
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