BGA Rework Training & Certification

BGA Rework Training & Certification Description:

This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the line BGA Rework Systems. Topics include a review of thermal profiling, preheat considerations, process techniques, review and interpretation of x-ray results. This is a 2 or 3 day optional course. One day lecture and up to 2 - days hands on training. Each student will be able to practice installing, removing, and re-balling  BGA components using both Lead & Lead Free Solders.

Topics Include

• Review of the different BGA packages - ceramic, plastic, metal and micro.
• A review of the parameters for establishing a safe thermal profile.
• Circuit board preparation - masking, baking and other process steps.
• BGA site preparation.
• Solder mask breakdown - how to prevent it, how to fix it.
• Basic Design Considerations
• BGA removal and replacement process.
• Inspection and interpreting x-ray results.
• Equipment review
• BGA Re-Balling & BGA pad Repair

Certification

Upon completing the course each student receives a certification from Precision PCB Services, Inc. confirming that they understand the science of high quality BGA rework, and have demonstrated the competent skills necessary for meeting the demands of modern electronic packaging. Certification references include: IPC-7095 Design and Process Implementation for BGA's. Recommended for operators, technicians, training instructors, PCB and chip design engineers, anyone who requires a working knowledge of the latest BGA rework techniques.

Location

This 3 - day course is available on site at Precision PCB Services, Inc. Training Facility in Oroville, California which is 1 hour north of the Sacramento Air Port, or it can be offered at your facility using your particular BGA rework equipment.