BGA Reballing Service
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BGA Reballing Service Description:
BGA Reballing and Solder Bumping for all types of SMD's
Lead, Lead Free and Solder Alloy Conversion.
Package types include but are not limited to:
- PBGA (Plastic Ball Grid Array)
- TBGA (Tape Ball Grid Array)
- uBGA (Micro BGA)
- CCGA (Ceramic Column Grid Array)
- CBGA (Ceramic Ball Grid Array)
- CPGA (Ceramic Pin Grid Array)
- LGA (Land Grid Array)
- QFN (Quad Flat No Lead)
- Interposers
- Double stacked components
- Ball Grid Array Connectors
Call (888) 406-2830
BGA Reballing Service was added in Sep 2016
BGA Reballing Service has been viewed 2803 times
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