ESSEMTEC USA

Essemtec is a worldwide leader in manufacturing of highly flexible Surface Mount Technology (SMT) production equipment - pick-and-place system, dispenser, printer, oven, storage system and software Solutions.

Manufacturer of Assembly Equipment, Component Packaging, Pick and Place, Screen Printing, Soldering

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Essemtec - Puma - Relentless High Speed Pick-and-Place and Dispensing

Essemtec - Your Expert in High Speed Fluid Dispensing & High-Mix SMT Placement Solutions

Essemtec AG is one of the worldwide leading companies in developing and manufacturing highly flexible Surface Mount Technology (SMT) production equipment, located in Switzerland.

We are a specialist in offering high speed fluid dispensing equipment as well as flexible high-mix SMT assembly solutions.

Our goal is to improve our customers’ workflows, setup times, defect rates, traceability and overall manufacturing efficiency through superior software and by providing managed SMD storage, to ensure they achieve significant competitive advantages.

PRODUCT PORTFOLIO:

  • SMD assembly systems (prototyping, low to flexible high-mix)
  • SMD dispensing systems (high speed dispensing machine)
  • SMD storage solutions
  • Stencil printers (manual, semi-automatic and fully automatic) 
  • Reflow ovens

Essemtec AG employs about 120 people worldwide. 4 subsidiaries and more than 30 distribution partners provide a presence in the major markets of Europe, America, Asia and Oceania.

ESSEMTEC USA Postings

12 products »

Puma - High Speed Pick & Place and Dispensing

RELENTLESS STRONG SMT PICK-AND-PLACE Strong, Flexible, Adaptive & Modular.  Expandable in any direction. Introducing - The Puma - State of the art technology. Expandable in any direction. Same a...

Pick & Place

 Puma - High Speed Pick & Place and Dispensing

Fox - Compact Automatic Pick-and-Place System

Essemtec Fox can have up to 180 feeder lanes, needs only 1sqm of floor space and can accept PCB’s of up to 406 x 305 mm. 180 feeder lanes within 1 m² production floor Component range from 0201 up to 80x33 mm...

Pick & Place

Fox - Compact Automatic Pick-and-Place System

Tarantula - Relentless All Terrain High Speed Dispensing

Introducing - The Tarantula - State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing...

Dispensing

Tarantula - Relentless All Terrain High Speed Dispensing

Spider - Compact High Speed Jetter and Dispenser

Essemtec Spider, the extreme fast and compact jet and general dispenser is rated for up to 150 000 dots per hour, dispenses 3D patterns and much more. Only 1 m² production floor Up to 150’000 dots/h (with ...

Dispensing

Spider - Compact High Speed Jetter and Dispenser

Cubus - The Next Generation of SMT Storage System

Flexible, Fully Automatic SMD Storage System. Cubus - the next-generation SMT storage device – innovates how SMT components are stored and provisioned for electronic manufacturing. For the first time, a storage device is fully us...

Board Handling - Storage

Cubus - The Next Generation of SMT Storage System

Cubus Large - Connective Lean Storage Solution

Introducing - The Cubus large - The right material, at the right time in the right location. The Cubus can be used as total automated SMD storage solution for small to mid-size companies as well as automated material replenishment units for high t...

Board Handling - Storage

Cubus Large - Connective Lean Storage Solution

ePlace - Pick & Place Operation Software

ePlace is a newly designed software based on the Essemtec software architecture “eez-Technology”. Fingertip operation Easy to use Universal CAD input Zoom of camera windows ...

Software

ePlace - Pick & Place Operation Software

eMIS -Management Information Software

The new eMIS Management Software Suite for SMD production includes functions for job planning, feeder setup optimization, stock management, traceability, operational data analysis, line management and much more. With eMIS, manager...

Software

eMIS -Management Information Software

SP002 - Manual Fine-pitch Stencil Printer, Guided Squeegee

Precise stencil printing system for low volumes. Easy to use, highly accurate and reliable printing system. Precise mechanical adjustment and excellent repeatability. Precise squeegee guidance with double squeegee. The SP002 ...

Printing

SP002  - Manual Fine-pitch Stencil Printer, Guided Squeegee

ZONDA Modular Full Convection Reflow Oven

ZONDA - 7 to 13 zones, freely configurable reflow oven. Zonda is a modular full convection oven for high volume soldering and curing. Number and type of zones is freely configurable to requirements. 7 to 13 zones...

Reflow

 ZONDA Modular Full Convection Reflow Oven

See all products from ESSEMTEC USA »

202 news releases »

Essemtec to Show the Latest Dispensing and Jetting Valves at SMTA Guadalajara

Nov 05, 2018 | Essemtec announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place November 14-15, 2018. VP of sales for North America Steve Pollock will be onsite showing the latest dispensing and jetting valves and will be available for sales and technical discussions.

Essemtec to Show FOX2 with Micro Valve / Placement System at SMTAI

Sep 17, 2018 | Essemtec will demonstrate the FOX2 with Micro Valve dispensing solder paste for 0201 and 01005 and placing them in same machine for NPI and prototyping.

Essemtec Wins NPI Award for Tarantula All Terrain Jet Dispenser

Feb 28, 2018 | Essemtec has been awarded a 2018 NPI Award in the category of Dispensing for its Tarantula – Relentless All Terrain Jet Dispenser. The system features state-of-the-art technology and can be easily integrated in any line. It is designed for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

Essemtec to Show All-in-One High Speed Assembly / Dispensing Platform at APEX

Jan 24, 2018 | Essemtec today announced plans to exhibit in Booth #3525 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing. With different modules, the system can grow synchronously with customer requirements for performance and processes. The company also will demonstrate the compact Spider jet dispenser and two FOX² systems – one with the solder paste Jet valve and one with the micro screw valve.

Puma/Tarantula - Essemtec‘s P&P/dispenser innovation at productronica

Oct 16, 2017 | Essemtec will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing at productronica 2017. The company will exhibit in Hall A3, Booth 218, Nov. 14 – 17, 2017 at the Messe München in Germany. With different modules, the system can grow synchronously with customer requirements for performance and processes.

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 | Essemtec today announced plans to exhibit in Booth #207 at SMTA International. The company will demonstrate the new FOX2 that combines jetting of solder paste or glue and placement in a single machine.

Essemtec to show all-in-one jetting/placement system at SMTA Capital Expo: the perfect NPI machine

Jul 27, 2017 | Essemtec today announced plans to exhibit at the SMTA Capital Show, scheduled to take place on Aug. 24, 2017. The company will demonstrate the FOX2 that combines jetting of solder paste or glue and placement in a single machine.

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Feb 21, 2017 | Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.

Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2

Jan 11, 2017 | Essemtec today announced plans to exhibit in Booth #1223 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Essemtec will debut the FOX² and demonstrate the compact Spider jet dispenser.

Juerg Schuepbach Joins Essemtec as International Sales Manager

Nov 21, 2016 | Essemtec AG appointed Juerg Schuepbach as International Sales Manager, effective November 1, 2016. He is responsible for strengthening the company's market presence around the globe and expanding its business into both underserved geographies and complementary industrial segments.

192 more news releases from ESSEMTEC USA »

Manufacturing Software

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