Functional Coatings, Decorative Coatings, PWB Fabrication Chemistry, Microelectronics Materials.
Enthone is a leading global supplier of high performance specialty chemicals and coatings. Our products provide innovative and cost-effective technology solutions for a wide range of markets and applications worldwide and serve the following industries:
- Building Hardware
- Heavy Equipment, Energy & Chemicals
- Aerospace & Defense
- Jewelry, Fashion & Decorative Finishes
- Industrial Finishes
As part of Alent plc, Enthone has manufacturing sites, research and development facilities, and sales and distribution centers worldwide. With a commitment to quality and customer satisfaction, all Enthone plants are ISO 9001 certified.
With corporate headquarters in West Haven, Connecticut, USA Enthone operates in more than 50 countries with ten manufacturing facilities and nine technical centers strategically located worldwide.
Six Sigma methodologies for creating, improving and maintaining business, as well as technical processes focused on increasing customer value, are employed throughout the company. Our focused team of experienced Black Belts and Green Belts are committed to an integrated partnership approach that addresses business challenges.
Oct 19, 2017 | Frank Xu Ph.D., Robert Farrell, Rita Mohanty Ph.D.
Wetting balance testing has been an industry standard for evaluating the solderability of surface finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as a function of Time, along with the individual data outputs "Time to Zero" T(0), "Time to Two-Thirds Maximum Force" T(2/3), and "Maximum Force" F(max) are usually used to evaluate the solderability performance of various surface finishes. While a visual interpretation of the full curve is a quick way to compare various test results, this method is subjective and does not lend itself readily to a rigorous statistical evaluation. Therefore, very often, when a statistical evaluation is desired for comparing the solderability between different surface finishes or different test conditions, one of the individual parameters is chosen for convenience. However, focusing on a single output usually doesn't provide a complete picture of the solderability of the surface finish being evaluated.
In this paper, various models here-in labeled as "point" and "area" models are generated using the three most commonly evaluated individual outputs T(0), T(2/3), and F(max). These models have been studied to quantify how well each describes the full wetting balance curve. The solderability score (S-Score) with ranking from 0 to 10 were given to quantify the wetting balance curve as the result of the model study, which corresponds well with experimental results....
May 21, 2003 | Enters into Licensing and Joint Development Alliance with ATMI
Apr 24, 2003 | Mr. Yim is a committee member of the Hong Kong Printed Circuit Association (HKPCA).
Feb 28, 2003 | Dr. Zhang will lead the global R&D and product formulation activities of the company's tin, tin alloy and lead-free technologies.