Electronic Assembly Materials

Company Information:

Company Postings:

Offered by:	M&M Associates

Electronic Assembly Materials Description:

Cermet Thick Film Materials, Au & Al Wire for Wirebonding, Flip Chip Underfills, Encapsulants, Potting Compounds, Paste & Film Adhesives, COB Die Attach, Solder Alternatives, Conformal Coatings, Vacuum Pick-up Tool, W/B Capallaries and Die Collets

Electronic Assembly Materials was added in Jan 2001

Electronic Assembly Materials has been viewed 133 times