Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems


CBAR's mission is to address the industry's need for advanced research on board assembly processes and systems. Most of the Center's work is project based, stemming from problems identified by industry partners. Our primary focus is to deliver solutions to real world problems and transfer the knowledge directly to industry. Our main research areas include: Process Technology & Development, Production & Manufacturing Systems, Factory Information Systems, Electrical Test & AOI, and Roadmapping/Benchmarking & Standards.

Georgia Institute of Technology Postings

3 technical articles »

Smart and Connected Bioelectronics for Seamless Health Monitoring and Persistent Human-Machine Interfaces

Jun 10, 2020 | Yun-Soung Kim and Woon-Hong Yeo

Recent advancement of flexible wearable electronics allows significant enhancement of portable, continuous health monitoring and persistent human-machine interfaces. Enabled by flexible electronic systems, smart and connected bioelectronics are accelerating the integration of innovative information science and engineering strategies, ultimately driving the rapid transformation of healthcare and medicine. Recent progress in the development and engineering of soft materials has provided various opportunities to design different types of mechanically deformable systems towards smart and connected bioelectronics....

High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers

Aug 10, 2017 | Sukhadha Viswanathan, Tomonori Ogawa, Kaya Demir, Timothy B. Huang, P. Markondeya Raj, Fuhan Liu, Venky Sundaram, Rao Tummala

This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules....

Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems

Apr 05, 2012 | L.G. Barajas, A. Kansal, A. Saxena, M. Egerstedt, A. Goldstein, E.W. Kamen

In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob...

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