ONYX29 Advanced SMT Production Rework & Assembly

ONYX29 Advanced SMT Production Rework & Assembly Description:

The new ONYX29 provides an unparalleled level of automation and process control for SMT rework and assembly. The new Tool Changer automatically selects and changes nozzles based on program instructions. The new Pick & Prep station provides automatic component pick up and preparaton including flux dipping, paste on device and solder paste dipping. The new Process Development Wizard automatically creates a complete rework process based on user response to five structured prompts. Other key functions include fully automated non-contact site cleaning, force-controlled auto placement and motorized vision/zoom.

ONYX29 Applications

Lead-Free, 0201, Flip Chip, Micro BGA/CSP, MEMS, Optoelectronics, Microwave, MLF’s and other devices. Existing technology including BGA, CSP, Leaded Devices and Surface Mount Connectors can also be easily accommodated.

Key Benefits:

• 9 micron placement accuracy (0.0003”) @ 3 Sigma
• High volume rework
• Ultra-fast heat up for Lead-Free Rework
• Fast, controlled board cool down
• Process repeatability
• Uniform joint temperature
• Precision air flow
• Simple, fast & easy to use software
• Large, clear images for component alignment
• Components up to 3.0” (75mm)
• Micro site cleaning
• Clean and uniform pads for replacement device
• Solder dots or lines down to 0.010”
• Dispensing of solder paste, epoxy, under fill or flux"

Specifications:

• Board size minimum = 3.0"W
• Board size maximum = 20.0"W x Unlimited
• Top and bottom side clearance = 1.20" (optional 2.75")
• Bottom heating: 19" x 19", 4 zones, 6000 watts
• Axes speed (X,Y,Z) = .15 ms
• Axes resolution (X,Y,Z) = .001 mm