Interconnect Systems, Inc.

ISI designs, manufactures and markets many innovative products, technologies and services that we refer to as Semiconductor Enhancement Products. Our basic product categories are: IC PACKAGES: High lead count IC packages utilizing printed circuit board interconnects, unique molding capabilities and thermal management solutions. FOOTPRINT CONVERSION PRODUCTS: ISI has produced more than 1000 adapter converting one semiconductor footprint to another, i.e BGA to QFP, QFP to PGA, packaged die to PGA or BGA, etc. FLEX CIRCUIT: ISI offers design through production flexible circuit solutions. BARE DIE to PCB or FLEX: ISI will design a solution and assemble bare die (wire bound or flip chip) to a PCB, adaptor, or flex circuit. CONSULTING AND DESIGN SERVICE: ISI can help you improve performance and lower cost through design solutions by isolating high performance components on high count multi-layer PCBs that then connect to lower layer count motherboards.