is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.
Founded in 1985, ROBOTHERM
is a Private Limited Company, subsidiary of the CALEO Group, and has a capital of Euros 230.000.
Located in PARIS region, ROBOTHERM
was first established to manufacture controlled atmosphere and in-line infrared ovens. Subsequently the company has developed positioning and indexing systems for semiconductor assembling and packaging equipment.
Then, the Smart Card Technology opened up new perspectives, which lead ROBOTHERM
to develop solutions adapted to high-standard applications, opening the way for a wide range of customized equipment dedicated to the micro-electronics markets.
� Standard products adapted for semiconductor, smart cards (with or without contacts), C.O.B, C.O.F, S.M.T and hybrids applications.
� Customized sub-systems for the micro electronic assembly applications in partnership with OEM's.
� Add-on solutions for standard equipment.
� Turnkey solutions.
Working alongside our customers in the development of their projects enables us to :
� Integrate our products into automated production lines,
� Develop interfaces between machinery operating on the same line,
� Modify, adapt or create mechanical and electrical interfaces for substrate handling,
� Design, from specifications, equipment dedicated to specific applications.
to package wire bonding
pick and place