ROBOTHERM

ROBOTHERM is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.

Manufacturer of Assembly Equipment

ROBOTHERM is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications. Founded in 1985, ROBOTHERM is a Private Limited Company, subsidiary of the CALEO Group, and has a capital of Euros 230.000. Located in PARIS region, ROBOTHERM was first established to manufacture controlled atmosphere and in-line infrared ovens. Subsequently the company has developed positioning and indexing systems for semiconductor assembling and packaging equipment. Then, the Smart Card Technology opened up new perspectives, which lead ROBOTHERM to develop solutions adapted to high-standard applications, opening the way for a wide range of customized equipment dedicated to the micro-electronics markets. Today, ROBOTHERM, offers: � Standard products adapted for semiconductor, smart cards (with or without contacts), C.O.B, C.O.F, S.M.T and hybrids applications. � Customized sub-systems for the micro electronic assembly applications in partnership with OEM's. � Add-on solutions for standard equipment. � Turnkey solutions. Working alongside our customers in the development of their projects enables us to : � Integrate our products into automated production lines, � Develop interfaces between machinery operating on the same line, � Modify, adapt or create mechanical and electrical interfaces for substrate handling, � Design, from specifications, equipment dedicated to specific applications.

work holders indexers to package wire bonding pick and place snape cure

ROBOTHERM Postings

4 products »

long wave infrared reflow and curing ovens

IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2 <24% ...

long wave infrared curing ovens

Glob top epoxy Matrix BGA Al2O3 substrate Smart card Tape BGA ...

uv dryers

Ink dryer Glob top Die attach Under fill ...

Capillary Underfill process

Reflow Oven Profiler