VT-S530 3D AOI for Pre and Post-Reflow Inspection
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VT-S530 3D AOI for Pre and Post-Reflow Inspection Description:
- True 3D Inspection Capability
- Plus Omron 3D Color-Highlight™
- High-Quality, Reliable Operation
- 10μm and 15μm Resolution
- Dual-Lane Availability
- Powerful, Offline Software Tools
High-precision Soldering Inspection [In common with VT-S730]
The VT-S7 series features 3D-SJI based on high-accuracy solder shape restoration.
Accurate quantitative inspection of solder bondability is now possible, greatly contributing to quality control requirements conforming to international standards such as IATF (ISO/TS)16949.
High-resolution inspection
With engineering specifications and high resolution compatible with the SEMI industry, the VT-S530 provides stable inspection of 0402/0603 microchip components!
High-productivity Inspection
The VT-S530 supports dual lane operation for higher production throughput.
Dual lane operation using various PCBs is possible, due to its handling capability up to the PCB size of 510 (W) x 330 (D) mm.
Global Support
More than 30 locations.
VT-S530 3D AOI for Pre and Post-Reflow Inspection was added in Apr 2019
VT-S530 3D AOI for Pre and Post-Reflow Inspection has been viewed 775 times
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