SMT Equipment

Thermally Managed - Heat Dissipating Printed Circuit Board Technology

Offered by:

ThermalWorks

Company Information:

ThermalWorks

NEW Thermally Managed, CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology

Santa Ana, California, USA

Laminates

  • Phone 714-960-5152
  • Fax 714-540-1299
Company Postings:

(2) products in the catalog

Thermally Managed - Heat Dissipating Printed Circuit Board Technology Description:

Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the following key features and benefits: � Reduced temperatures of electronic components. � High thermal conductivity. � Closer matching of coefficient of thermal expansion between components and the PCB. � High Young�s modulus of elasticity. � Reduced board deflections when subjected to mechanical loading. These attributes will lead to higher component reliability and better performance. The STABLCOR TM PCB uses a patent pending design process to incorporate a thermally conductive material into the lamination of the printed circuit board. The result is a thermally conductive PCB that has a low CTE and a high Young�s modulus of elasticity. Table-1 below displays the STABLCOR TM material properties and standard FR-4 Copper Foil, Glass-Reinforced Polymer properties. Material K, W/m . K, Modulus msi, CTE ppm/� �C STABLCOR 220 8-12 4-12 FR-4 PCB .7 3 22 Polyimide .7 3 16

Thermally Managed - Heat Dissipating Printed Circuit Board Technology was added in Mar 2001

Thermally Managed - Heat Dissipating Printed Circuit Board Technology has been viewed 3 times

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