Thermally Managed - Heat Dissipating Printed Circuit Board Technology

Thermally Managed - Heat Dissipating Printed Circuit Board Technology Description:

Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the following key features and benefits: � Reduced temperatures of electronic components. � High thermal conductivity. � Closer matching of coefficient of thermal expansion between components and the PCB. � High Young�s modulus of elasticity. � Reduced board deflections when subjected to mechanical loading. These attributes will lead to higher component reliability and better performance. The STABLCOR TM PCB uses a patent pending design process to incorporate a thermally conductive material into the lamination of the printed circuit board. The result is a thermally conductive PCB that has a low CTE and a high Young�s modulus of elasticity. Table-1 below displays the STABLCOR TM material properties and standard FR-4 Copper Foil, Glass-Reinforced Polymer properties. Material K, W/m . K, Modulus msi, CTE ppm/� �C STABLCOR 220 8-12 4-12 FR-4 PCB .7 3 22 Polyimide .7 3 16