NC600 Lead-Free, No-Clean Solder Wire

NC600 Lead-Free, No-Clean Solder Wire Description:

Qualitek has developed a unique no clean flux system designed specifically for high temperature lead free alloys. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type. NC600 exhibits virtually no spattering. NC600 conforms to J-STD-004, REL0.

Main Features

• Excellent wettability
• Hard non-conductive residues

Solder Composition

Qualitek Sn/Ag/Cu (Tin/Silver/Cu) Alloys are designed as a lead-free alternative for Sn/Pb alloys for electronics assembly operations. The Qualitek Sn/Ag/Cu alloys conform and exceed the impurity requirements of J-Std-006 and all other relevant international standards.

Flux Percentage

Qualitek utilizes a state-of–the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for lead free solder is 2.0-4.0%.

Wire Diameter

SnAgCu alloy wire is available in a variety of diameters. The chosen diameter is based on application methods, pad size, and desired solder joint volume. Generally, the diameter of the wire should be slightly larger than the width/diameter of the joint or connection to be soldered. Below is a list of standard diameters.

Standard Packaging:

Wire solder is packaged on spools sizes: 1/2lb., 1lb., 1 Kilogram, 5lb., 10lb., 20lb