DSP 825HF No-Clean Solder Paste Halogen Free Lead Free
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DSP 825HF No-Clean Solder Paste Halogen Free Lead Free Description:
DSP 825HF is a lead-free, no clean, halogen-free solder paste designed specifically for a wide range of lead-free
alloys. It provides an x-treme fluxing activity level with excellent wetting on copper OSP-coatings. Wide reflow
process windows combined with high thermal stability yield solder joints with smooth surfaces.
In addition, DSP 825HF offers repeatable, consistent printing characteristics combined with long stencil and tack
life to accommodate high speed printing. This material yields excellent printing capability across various board
designs and ultra-fine pitch.
Main Features
Excellent wetting and coalescence for pads as small as 0.25 Pm (0.010”) with 4 mil stencil
Halogen-Free
Low Voiding
Superior resistance to hot slump
Extended stencil life
Long tack time
Medium soft non-cracking residue
Suitable with air or nitrogen atmosphere
Complies with RoHS Directive 2002/95/EC
DSP 825HF No-Clean Solder Paste Halogen Free Lead Free was added in Apr 2015
DSP 825HF No-Clean Solder Paste Halogen Free Lead Free has been viewed 936 times
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