DSP862 No-Clean Lead Free Solder Paste
DSP862 No-Clean Lead Free Solder Paste Description:
862 no clean lead free solder paste has been designed for a broad range of surface mount applications and has a wide processing window.
Delivers comparable performance to Sn/Pb paste. Yields excellent print capability and will minimize transition concerns from Sn/Pb to lead free process. Complies with ROL0 IPC and IPC Class III voiding classification ensures long-term product reliability. Yields smooth, clear, non-conductive soft residues and shiny uniform joints after reflow.
DSP862 No-Clean Lead Free Solder Paste was added in Apr 2015
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