WS700 Lead Free Water Soluble (OA) Solder Wire

WS700 Lead Free Water Soluble (OA) Solder Wire Description:

Lead free water-soluble wire solder. Provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. WS700 exhibits virtually no spattering. WS700 conforms to J-STD-004, ORH1.

Main Features

• Excellent wettability
• Hard non-conductive residues

Solder Composition

Qualitek Sn/Ag/Cu (Tin/Silver/Cu) Alloys are designed as a lead-free alternative for Sn/Pb alloys for electronics assembly operations. The Qualitek Sn/Ag/Cu alloys conform and exceed the impurity requirements of J-Std-006 and all other relevant international standards.

Wire Diameter

SnAgCu alloy wire is available in a variety of diameters. The chosen diameter is based on application methods, pad size, and desired solder joint volume. Generally, the diameter of the wire should be slightly larger than the width/diameter of the joint or connection to be soldered. Below is a list of standard diameters.

Flux Percentage

Qualitek utilizes a state-of–the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for lead free solder is 2.0-4.0%.

Flux Core

Qualitek has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. WS700 exhibits virtually no spattering. WS700 conforms to J-STD-004, ORH1.