Institute of Electrical and Electronics Engineers (IEEE)

IEEE is the world's largest professional association dedicated to advancing technological innovation and excellence for the benefit of humanity.

Association / Non-Profit

The Institute of Electrical and Electronics Engineers or IEEE is an international non-profit, professional organization for the advancement of technology related to electricity. It has the most members of any technical professional organization in the world, with more than 395,000 members in around 150 countries.

IEEE creates an environment where members collaborate on world‐changing technologies – from computing and sustainable energy systems, to aerospace, communications, robotics, healthcare, and more. The strategic plan of IEEE is driven by an envisioned future that realizes the full potential of the role of IEEE in advancing technology for humanity.

Institute of Electrical and Electronics Engineers (IEEE) Postings

3 technical articles »

Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications

Aug 22, 2018 | Bhupender Singh, Gary Menezes, Scott McCann, Vidya Jayaram, Urmi Ray, Venky Sundaram, Raj Pulugurtha, Vanessa Smet, Rao Tummala

Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2.

This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances....

Microspring Characterization and Flip-Chip Assembly Reliability

May 29, 2014 | B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F. Böhringer, A. V. Krishnamoorthy, E, M. Chow

Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance (< 100 mΩ) and high compliance (> 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is < 40 mΩ. A daisy-chain test die consisting of 2844 contacts is assembled into flip-chip packages with 100% yield. Thermocycle and humidity testing suggest that packages with or without underfill can have stable resistance values and no glitches through over 1000 thermocycles or 6000 h of humidity.

This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules....

A System Level Electrostatic Discharge Protection Modeling Methodology for Time Domain Analysis.

Apr 03, 2014 | Nicolas Monnereau, Fabrice Caignet, David Trémouilles, Nicolas Nolhier, Marise Bafleur.

A system level modeling methodology is presented and validated on a simple case. It allows precise simulations of electrostatic discharge (ESD) stress propagation on a printed circuit board (PCB). The proposed model includes the integrated circuit (IC) ESD protection network, IC package, PCB lines, passives components, and externals elements. The impact of an external component on the ESD propagation paths into an IC is demonstrated. Resulting current and voltage waveforms are analyzed to highlight the interactions between all the elements of an operating PCB. A precise measurement technique was designed and used to compare with the simulation results. The model proposed in this paper is able to predict, with good accuracy, the propagation of currents and voltages into the whole system during ESD stress. It might be used to understand why failures occur and how to fix them with the most suitable solution....

4 news releases »

IEEE Honors Ceremony Recognizes Innovators

Aug 10, 2010 | The "fathers" of DSL and the Internet were among the pioneers celebrated at the 2010 IEEE Honors Ceremony. The event recognizes individuals and companies from the engineering community for their outstanding accomplishments. This year, 21 medals and recognitions were presented to 27 innovative individuals, including the pioneers of many of today's most important technologies

University of Maryland professor, renowned author and editor dr. Michael Pecht to address 2008 International Reliability Physics Symposium.

Apr 22, 2008 | The IEEE International Reliability Physics Symposium's (IRPS) 46th annual conference announces the keynote speaker of this year's event will be Dr. Michael Pecht, chair professor and the director of the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland.

Reliability Symposium to Address Interconnect Issues

Mar 19, 2003 | Advancements in research into thin dielectric breakdowns and exploration in the use of high-k gate dielectrics and low-k materials as interconnects are the focus of next week's International Reliability Physics Symposium.

IEEE committee approves 802.11g standard

Nov 19, 2001 | An IEEE committee has ratified an 802.11g wireless LAN standard, paving the wave for the standard's finalization by the IEEE body next spring.

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