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Institute of Electrical and Electronics Engineers (IEEE) Postings
Aug 22, 2018 | Bhupender Singh, Gary Menezes, Scott McCann, Vidya Jayaram, Urmi Ray, Venky Sundaram, Raj Pulugurtha, Vanessa Smet, Rao Tummala
Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2.
This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances....
May 29, 2014 | B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F. Böhringer, A. V. Krishnamoorthy, E, M. Chow
Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance (< 100 mΩ) and high compliance (> 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is < 40 mΩ. A daisy-chain test die consisting of 2844 contacts is assembled into flip-chip packages with 100% yield. Thermocycle and humidity testing suggest that packages with or without underfill can have stable resistance values and no glitches through over 1000 thermocycles or 6000 h of humidity.
This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules....
Apr 03, 2014 | Nicolas Monnereau, Fabrice Caignet, David Trémouilles, Nicolas Nolhier, Marise Bafleur.
A system level modeling methodology is presented and validated on a simple case. It allows precise simulations of electrostatic discharge (ESD) stress propagation on a printed circuit board (PCB). The proposed model includes the integrated circuit (IC) ESD protection network, IC package, PCB lines, passives components, and externals elements. The impact of an external component on the ESD propagation paths into an IC is demonstrated. Resulting current and voltage waveforms are analyzed to highlight the interactions between all the elements of an operating PCB. A precise measurement technique was designed and used to compare with the simulation results. The model proposed in this paper is able to predict, with good accuracy, the propagation of currents and voltages into the whole system during ESD stress. It might be used to understand why failures occur and how to fix them with the most suitable solution....
Aug 10, 2010 | The "fathers" of DSL and the Internet were among the pioneers celebrated at the 2010 IEEE Honors Ceremony. The event recognizes individuals and companies from the engineering community for their outstanding accomplishments. This year, 21 medals and recognitions were presented to 27 innovative individuals, including the pioneers of many of today's most important technologies
Apr 22, 2008 | The IEEE International Reliability Physics Symposium's (IRPS) 46th annual conference announces the keynote speaker of this year's event will be Dr. Michael Pecht, chair professor and the director of the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland.
Mar 19, 2003 | Advancements in research into thin dielectric breakdowns and exploration in the use of high-k gate dielectrics and low-k materials as interconnects are the focus of next week's International Reliability Physics Symposium.
Nov 19, 2001 | An IEEE committee has ratified an 802.11g wireless LAN standard, paving the wave for the standard's finalization by the IEEE body next spring.