SMT Equipment

Spectrum II S2-900 Series Fluid Dispensers

Company Information:

A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.

Carlsbad, California, USA

Manufacturer

  • Phone 760-431-1919
  • Fax 760-431-2678

See ASYMTEK Website »

Company Postings:

(22) products in the catalog

(12) technical library articles

(85) news releases

Spectrum II S2-900 Series Fluid Dispensers

Spectrum II S2-900 Series Fluid Dispensers

Name:

Spectrum II S2-900 Series Fluid Dispensers

Category:

Dispensing

Offered by:

ASYMTEK Products | Nordson Electronics Solutions

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Spectrum II S2-900 Series Fluid Dispensers Description:


The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs

High Speed, High Accuracy, Precision Dispensing System.

Higher consistency leads to higher yield and maximum profitability for your business. Whether it is dispensing underfill in PCBA applications, precise coating in mobile or consumer electronics, or solder paste sealing lines, Spectrum® II fluid dispensers are the globally preferred systems for mass production.

Choose a standard System Package to get your fluid dispensing system with minimal lead time.

Brochures available in English, Spanish, and Chinese. Click on the product link below.

  • Small space-saving footprint
  • Fast and precise narrow gap dispensing
  • Enhanced throughput with dual-simultaneous dispensing
  • Patented closed-loop process controls
  • Scalable and flexible support for various applications
  • Feature-rich Fluidmove® dispensing software
  • Market-leading total system X-Y wet dispense accuracy
  • Precision Z-axis control for consistent line widths

Recommended Applications

  • Electromechanical Device Assembly
    • MEMS sealing and packaging
    • Hard disk drive assembly
  • Semiconductor Packaging
    • 1st and 2nd level underfill on flip chip and CSP
    • 3D packaging underfill
  • SMT and PCB Assembly
    • Low temperature solder paste on smartphone motherboard
    • Package on Package (PoP) underfill
  • LED Assembly
    • Silicone-phosphor cavity encapsulation

Read our white paper: Making Sense of Accuracy, Repeatability and Specification for Automated Fluid Dispensing Systems

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Spectrum II S2-900 Series Fluid Dispensers was added in Nov 2013

Spectrum II S2-900 Series Fluid Dispensers has been viewed 2674 times

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