DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet Description:

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods.

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray in a wide variety of assembly operations. Jetting eliminates the overspray and material waste associated with ultrasonic and spray application methods. For no-clean fluxes, reduction in residue results in better package reliability.

No-flow underfill is another fluid that can be dispensed using the DJ-2200 jet. Nordson ASYMTEK recommends contacting our Applications Engineering Group before selecting a fluid appropriate for this process.

• Non-contact dispensing
• Eliminates z-axis motion during dispensing and virtually eliminates height sensing
• Tolerates greater variations in PCB or substrate planarity
• Adaptable for use from prototype to high-volume in-line production
• Flux jetting allows 100% coverage and a minimal amount of flux, producing less residue to remove after reflow

Recommended Applications

• Flux Jetting
• No-flow Underfilling
• Direct Chip Attach (DCA)
• Flip Chip in Package (FCIP)
• Ball Grid Array (BGA)
• Multi-chip Module (MCM) Assembly
• Ball Attach

Dispensing System

• Spectrum™ II S2-930 Series Vented Dispensers for Jetting Selective Flux and Precision Coating
• Quantum® Series In-Line, Large-Format Fluid Dispensing for SMT, PCB, and MEMS