SMT Equipment

860 Pressure Curing Oven (PCO)

Company Information:

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA


  • Phone 973-377-6800
  • Fax 973-377-3862

See Heller Website »

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860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)


860 Pressure Curing Oven (PCO)


Curing Equipment

Offered by:

Heller Industries Inc.

View 860 Pressure Curing Oven (PCO)


860 Pressure Curing Oven (PCO) Description:

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.

  • PCO pressurizes air into a rigid vessel and heats & cools with forced convection.
  • Heaters, heat exchangers and blowers are internal to the pressure vessel.
  • When the curing process is complete, the pressure oven automatically relieves its pressure to 1atm and cools.

Process Specification:

  • Process time: Generally 120 min or User's spec
  • Operating temp: 60oC ~ 200oC
  • Maximum temp: 220oC
  • Operating pressure: 1 bar - 10 bar
  • Capacity: 24 Magazines (typical)
  • Cooling method: PCW (17oC - 23oC)
  • Cooling water pressure: 25 - 40 psi

Pressure Cure Applications:

  • Composite Forming for the printing industry
  • Die Attach Curing
  • Wafer Laminating
  • Thermal Compress Bonding
  • Underfill Curing
  • Via Filling
  • Film & Tape Bonding

View 860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO) was added in Aug 2015

860 Pressure Curing Oven (PCO) has been viewed 2403 times

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