DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency Description:

ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be printed using a conventional stencil printing process with a single thickness stencil.

ProActiv helps manufacturers rise to the challenges of increasing miniaturisation and higher board densities. This breakthrough process technology from DEK enables next generation components to be printed alongside standard components, using only a conventional printing process with a single thickness stencil.

While there are many factors in a stencil printing process, it is the stencil aperture area ratio that fundamentally dictates what can or cannot be printed. As stencil aperture ratios decrease to address component miniaturisation and heterogeneous assemblies, the chance of successful printing falls. While existing area ratio process rules limit conventional printing with smaller apertures, ProActiv breaks through and redefines these rules.

A revolutionary printing technology, ProActiv extends the print process window to a level that enables consistent printing of small apertures for 0.3mm CSPs and 01005 passives. When activated, ProActiv energises the solder paste in contact with the squeegee blade. It’s a unique action known as ‘shear thinning’ that instantly makes the paste more compliant without altering its composition. This process increases the aperture fill to transform solder paste transfer efficiency, delivering immediate improvements in quality, yield and throughput – even with today’s subassemblies.

ProActiv offers a robust and stable process that significantly increases yield to reduce rework and scrap. It also reduces stencil cleaning frequency to increase throughput, and improves stencil and squeegee blade life through less squeegee blade to stencil friction. The result is dramatically lower production costs and unprecedented paste transfer efficiency.

Features:

• Designed to improve paste transfer efficiency
• Uses single 300mm holder with squeegee sizes of 170mm, 200mm, 250mm and 300mm
• 60 degree blade angle; 6mm or 15mm blade overhang
• Will perform as standard squeegee when required, featuring the same mechanical characteristics
• Easy to use, no operator training necessary
• Closed loop control, visual operational verification & on/off activation
• All new Horizon 02iX, Horizon 01iX, Europa & Galaxy platforms are ProActiv-ready
• Field-retrofittable on all DEK platforms since 2006; typical 5 hours on-site set-up

Benefits:

• Dramatically improves yield for mixed technology applications
• Enhances stencil aperture fill and paste release
• Substantially extends the print process window
• Enables consistent printing of small apertures for 0.3mm CSPs & 01005 passives
• Reduces rework & scrap
• Extends stencil & squeegee blade life
• Simple set-up & reduced operator intervention
• Closed loop feedback for optimum system performance