Sanmina-SCI Corporation is a leading electronics contract manufacturer serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina-SCI provides end-to-end manufacturing solutions, delivering unsurpassed quality and support to OEMs primarily in the communications, defense and aerospace, industrial and semiconductor systems, medical instrumentation, multimedia, enterprise computing and storage, and automotive technology sectors.
Sanmina-SCI has facilities strategically located in key regions throughout the world.
Oct 27, 2020 | Robert Kinyanjui, Ph.D., Quyen Chu, Polina Snugovsky, Ph.D., Richard Coyle, Ph.D.
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance....
Feb 20, 2019 | Jim Fuller, Sanmina-SCI; Karl Sauter, Oracle Corporation; Scott Hinaga, Cisco; Tian Qingshan, Huawei; John J Davignon, HDP User Group; Brian Butler, Introbotix; Ted Antonellis, Michael Coll, John Marshall, John Marshall, MacDermid Enthone; Joseph Smetana,
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion....
Mar 05, 2018 | J. Li, S. Poranki, K. Srihari - Watson Institute for Systems Excellence, R. Gallardo, M. Abtew, R. Kinyanjui - Sanmina-SCI Corporation
Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards....
Jan 08, 2015 | Richard Coyle, Richard Popowich, Debra Fleming, Peter Read - Alcatel Lucent, Raiyo Aspandiar, Vasu Vasudevan, Steve Tisdale - Intel Corporation, Iulia Muntele - Sanmina Corporation.
Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption.
Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern...
May 03, 2011 | Sanmina-SCI announced specialized services to help oil and gas companies be more competitive with scalable capacity near the world's major exploration and production operations. Sanmina-SCI's array of design, engineering and manufacturing services are being showcased at Booth # 531 during the Offshore Technology Conference in Houston, May 2-5.
Dec 07, 2010 | Sanmina-SCI Corporation today announced its India Design Center is providing significant advantages to Original Equipment Manufacturer (OEM) customers in the multimedia, communications, renewable energies and medical markets.
Aug 05, 2003 | Agreement Will Create Premier Design/Product Provider in Growing Enterprise Computing and Storage Sector
Jul 11, 2003 | Alliance to accelerate the development of thermal solutions for large-scale electronic computer equipment, including Sanmina-SCI�s ECOBAY� line of enclosure products.
Jun 06, 2003 | High performance 19-inch Enclosure Server Rack that sets the standard for
May 22, 2003 | Facility Achieves Military Qualification
Apr 30, 2003 | Sanmina-SCI Corporation announced its Optimal High Speed Printed Circuit Board (PCB) Solutions seminar is taking place today in Ottawa, Canada. This marks the third in Sanmina-SCI's series of Excellence in Technology seminars.
Apr 09, 2003 | ICON Industry Consulting, Inc., a supply chain management solution specialist, today announced Sanmina-SCI Corporation (Nasdaq: SANM), a leading supplier of integrated design and electronics manufacturing solutions (EMS), is using ICON's SCM software to significantly improve production efficiency in a number of its fulfillment centers.
Apr 04, 2003 | Sanmina-SCI Corporation is solidifying its reputation for advanced technology leadership and superior quality by proactively developing lead free processes and implementing its RoHS (Reduction of Hazardous Substances) program in all facilities worldwide. In addition, the company has also undertaken a leadership initiative in educating and bringing its suppliers into alignment with its environmentally friendly programs.
Feb 21, 2003 | The Costa Mesa facility has achieved the highest level of qualification for line width (2 mils) and spacing (3 mils) to date.