SMT Equipment

8098 Large Area Ball Bonder

8098 Large Area Ball Bonder

8098 Large Area Ball Bonder


8098 Large Area Ball Bonder

Offered by:

Kulicke & Soffa Pte. Ltd.

Company Information:

Kulicke & Soffa Pte. Ltd.

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments.

Singapore, Singapore

Assembly, Manufacturer of Assembly Equipment, Pick and Place

  • Phone +65 6880-9600
  • Fax 215-784-7588

Kulicke & Soffa Pte. Ltd. website

Company Postings:

(1) product in the catalog

8098 Large Area Ball Bonder Description:

Speeds of up to 7 wires/sec, extreme precision for 60 �m fine-pitch devices, and a bondable area of 15.75" (400 mm) x 13" (330 mm), make the K&S Model 8098 the fastest, most accurate, and most versatile large area ball bonder in the entire industry. Flexible, user-selectable bonding processes allow numerous standard and worked loop formations, as well as enhanced hybrid looping, Jwire and BGA looping. With an architecture adaptable to almost any material handling challenge, the 8098 is designed around the needs of manufacturers bonding to ceramic snapstrates, PCBs, flex and leadframes. Choose from a full line of automatic and manual material handling solutions, or tap into our wealth of applications expertise to let us help you develop a custom solution that works best for you. An excellent choice for BGA, COB, leadframe, flex substrates, MCM and hybrid applications, the 8098 also enables premium user selectable options for many different loop formations.

8098 Large Area Ball Bonder was added in Aug 2002

8098 Large Area Ball Bonder has been viewed 107 times

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