SMT Equipment

Amkor IC Pacakge Portfolio

Company Information:

Amkor Technology is the world's largest independent supplier of outsourced packaging and test semiconductor interconnect services; with more than 33 years of continuous improvement, growth and innovation.

Chandler, Arizona, USA

  • Phone 480.821.5000
  • Fax (610) 431-5881

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Company Postings:

(1) product in the catalog

(2) technical library articles

(6) news releases

Offered by:

Amkor Technology, Inc.


Amkor IC Pacakge Portfolio Description:

Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect between chip and system board has become both a significant challenge and an enabling technology. Advances in packaging are being driven by semiconductor technology and the explosion in the wireless and internet markets. Amkor is an industry leader in finding packaging solutions to meet these complex requirements. To serve the diverse needs of more than 200+ world class semiconductor manufacturers, Amkor offers more than 850+ different package formats and sizes, from traditional leadframe packages for through-hole and surface mounting, all the way to the latest chip scale and ball grid array solutions required in high pin count and high density applications. This broad product family allows Amkor to be a single source for many of its customers' total IC packaging requirements from legacy devices to tomorrow's System in Package solutions. ADVANCED PRODUCT DEVELOPMENT: Stacked CSP Ultra CSP™ Wafer Level Packaging SYSTEM in PACKAGE: SiP Module MultiMedia Card (MMC) IMAGE SENSOR / OPTICAL PACKAGES: VisionPak™ LCC LAMINATE PACKAGES: ChipArray® CTBGA / CVBGA Enhanced BGA (EBGA) etCSP™ Flip Chip CSP (fcCSP) High Performance BGA (HPBGA) MCM-PBGA PBGA SuperBGA® Super Flip Chip (SuperFC™) Thermally Enhanced PBGA (TEPBGA) TAPE PACKAGES: fleXBGA® µBGA® TapeArray™ BGA Tape-SuperBGA® LEADFRAME PACKAGES: ExposedPad™ LQFP / TQFP ExposedPad™ SOIC / SSOP ExposedPad™ TSSOP Flip Chip MicroLeadFrame™ (fcMLF) LQFP LQFP PowerQuad® 2 LQFP PowerQuad® 4 Multi-Chip & Stacked Leadframe MicroLeadFrame™ (MLF) MQFP MQFP PowerQuad® 2 MQFP PowerQuad® 4 PDIP / SPDIP PLCC PSOP 2 & 3 / PSSOP SOIC / SOJ SOT-23 / SC-70 SSOP TQFP TSOP 1 TSSOP CERAMIC / HERMETIC PACKAGES: CBGA CDIP / CerDIP CerPak CLGA CMCM CPGA CQFP CSOIC CSSOP Flat Pack LCC PPGA Side Braze

Amkor IC Pacakge Portfolio was added in Sep 2002

Amkor IC Pacakge Portfolio has been viewed 165 times

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