PARMI

A world leader in 3-dmensional inspection for printed solder paste on PCB. Top level quality and high inspection speed of our machines are based on the unique 3D RSC (Range Scan Camera) sensors.

Inspection

Through our 10 years experience and specialized in-house expertise in laser measurement and software development PARMI is now the Global leader in Solder Paste Inspection. Our close relationship with our customer has brought us to this. We have made it our priority to listen to our customers needs to develop our technology. We consider ourselves to be truly a customer driven company.

PARMI stands for Pattern Recognition and Machine Intelligence.

PARMI Postings

3 products »

SPI HS60 - 3D Solder Paste Inspection System

The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condi...

Inspection

SPI HS60 - 3D Solder Paste Inspection System

SPI 50T - 3D Solder Paste Inspection System

The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing...

Inspection

SPI 50T - 3D Solder Paste Inspection System

SPI 2500 3D Solder Paste Inspection System

The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste pr...

Inspection

SPI 2500 3D Solder Paste Inspection System

11 news releases »

PARMI Wins Award for New SPI Defect Repair Feature for SIGMA X New “Jet” module increases SPI throughput and ROI

Feb 24, 2015 | PARMI announces that it has been awarded a 2015 NPI Award in the category of Test & Inspection – SPI for its Jet Defect Repair Feature. This represents the third consecutive year that PARMI has received the award, which was presented during a Tuesday, Feb. 24, 2015 ceremony at the San Diego Convention Center during the IPC APEX EXPO.

PARMI to Showcase “The Jet” Inside SPI at APEX 2015

Jan 21, 2015 | PARMI will showcase solutions for improving the assembly process and equipment ROI at the IPC APEX EXPO, being held in San Diego, CA, February 22-26, 2015.

PARMI and Aegis Develop xLink Machine Adapter to Connect SPI Data to FactoryLogix Manufacturing Software in Real-Time

Nov 18, 2014 | PARMI and Aegis Software announce the development of the xLink adapter to enable real-time connectivity of SPI results to Aegis’ FactoryLogix Manufacturing Operations Systems. With real-time data integration, manufacturers can immediately identify SPI defects, and take corrective actions to improve PCB yield.

PARMI and Aegis Develop xLink Machine Adapter to Connect SPI Data to FactoryLogix Manufacturing Software in Real-Time

Nov 17, 2014 | PARMI announces the development of the xLink adapter to enable real-time connectivity of SPI results to Aegis’ FactoryLogix Manufacturing Operations Systems. With real-time data integration, manufacturers immediately can identify SPI defects and take corrective actions to improve PCB yield.

ARMI Announces New SPI Defect Repair Feature for SIGMA X New “Jet” module increases SPI throughput and ROI

Sep 06, 2014 | PARMI announces the Jet Solder Jet Dispenser Unit for its award-winning SIGMA X SPI Series. Jet repairs solder paste deposits within the machine to eliminate expensive rework and scrap, maximizes throughput and increases ROI.

PARMI Appoints Southwest Systems Technology

May 22, 2014 | PARMI announces that it has appointed Southwest Systems Technology as its manufacturers’ representative throughout Texas, Oklahoma, Arkansas and Louisiana.

PARMI Accepts an NPI Award at APEX for its New SIGMA X SPI System

Mar 26, 2014 | PARMI announces that it has been awarded a 2014 NPI Award in the category of Test & Inspection – SPI for its SIGMA X series solder paste inspection system.

Visit Booth #1249 at APEX – PARMI to Showcase SIGMA X SPI System

Mar 02, 2014 | PARMIannounces that it will exhibit in booth #1249 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

PARMI’s HS-70 Solder Paste Inspection System Receives Circuits Assembly’s Prestigious NPI Award

Feb 25, 2013 | PARMI announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – SPI for its SPI HS70 Series.

PARMI Opens New Facility in Massachusetts

Jan 31, 2013 | PARMI, a premier provider of Solder Paste Inspection (SPI) equipment for the electronics assembly industry, announces its expansion in the Americas.

1 more news releases from PARMI »

SMT in-printer dispensing

Reflow Oven Profiler