SIPAD Systems supplies SIPAD solid solder coating services to OEM's, CEM,s and Printed Circuit Manufacturers in both eutectic and lead free solder versions.
How does SIPAD ssd work?
Attaching surface mount devices (SMDs) to printed circuits is a challenge that generates a lot of debate as to what methods work for which users at any given time during the lifetime of a product. There are many methods used to place and fuse SMD components to one or both sides of a printed circuit board. Most concentrate on the high volume through put needed once the product has been prototyped and tested at the development level. But what about the methods used to assemble prototype quantities, usually in the lab or at small contract manufacturers specializing in small runs. Solid Solder Deposit (SSD) is emerging as a reliable solution to many of the challenges facing this segment of the cycle often overlooked.
SIPAD uses the solder mask to form wells around each surface mount land. The wells have sidewalls that provide solder mask dams between smd pads.Solder paste is applied into the wells using a normal stencil printing operation. After a sufficient amount of paste is applied, the printed circuit board is subjected to a standard reflow. During this initial reflow, the solder paste is fused and a pad or bump is formed with a meniscus above the plane of the solder mask.
At this point the boards are thoroughly washed to remove any solder balls or residue. Because there are no components cleaning is much more efficient.
After washing, the boards are placed into a flattening system, which heats the solder deposit to the melting point and flattens the pads between the platens of a cold press. This process freezes the solder deposits into a SSD planar with all the rest of the smd pads.
Once the SIPAD board is flattened, the same stencil is used to apply adhesive no clean flux to the surface mount pads. This flux was developed especially for SIPAD and is the only product available that is designed to be applied and dried to a tacky finish, then protected by a release paper to maintain the tack. This flux holds the components in place and burns off during the final reflow leaving no noticeable residue.
During the final reflow, the SIPAD returns to the original shape, attaching the component leads in the process.
The solder shape is very predictable during this reflow cycle.
SIPAD Systems Inc. Postings
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards...
Nov 27, 2011 | Well positioned High Tech Rep group in Southeast will help expand the SIPAD presence in a major electronics OEM and Military sub-contractor Marketplace.
Oct 25, 2011 | Sipad Systems partners up with K&F Electronics regional sales manager Gene Guy in northern California.
Oct 21, 2011 | The first event is PCB Carolina on November 8th at the Raleigh Convention Center, the second event will be the following week when Matt Kehoe will be speaking along with Dr. Dan Baldwin at the SMTA Carolina Chapter meeting.
Oct 16, 2011 | 14 years after it was introduced, SIPAD process still being pioneered.
Oct 09, 2011 | Well established Rep Groups will help expand the SIPAD presence in The Midwest and Southeast
Nov 08, 2007 | Alpharetta-based company adds laser cut stencils to their capabilities
Feb 23, 2007 | Alpharetta-based company continues strong growth in the military/space sector
Apr 01, 2003 | Lead Free SIPAD ssd