SMT Equipment

APR Solder Paste Dipping Plate

Company Information:

BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard

Rolling Meadows, Illinois, USA

Consultant / Service Provider, Manufacturer, Standards Setting / Certification, Training Provider

  • Phone 224-387-3256
  • Fax 847-797-3255

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APR Solder Paste Dipping Plate

APR Solder Paste Dipping Plate

Name:

APR Solder Paste Dipping Plate

Category:

Solder Paste Stencils

Offered by:

BEST Inc.

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APR Solder Paste Dipping Plate Description:

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a board or other device. It can also be used to dip flux of pre-bumped device.

These plates are custom-made and can be ordered to accommodate different component sizes and ball diameters.

The dipping plates can be used as stand-alone entities or be used with the tooling holes on APR rework systems.

Delivery is 2-3 days after drawing approval by the customer.

In order to get started we require the following:

  1. Part mechanicals
  2. Type of machine the plate will be used with or free-standing

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APR Solder Paste Dipping Plate was added in Apr 2015

APR Solder Paste Dipping Plate has been viewed 872 times

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