APR Solder Paste Dipping Plate
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APR Solder Paste Dipping Plate |
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APR Solder Paste Dipping Plate Description:
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a board or other device. It can also be used to dip flux of pre-bumped device.
These plates are custom-made and can be ordered to accommodate different component sizes and ball diameters.
The dipping plates can be used as stand-alone entities or be used with the tooling holes on APR rework systems.
Delivery is 2-3 days after drawing approval by the customer.
In order to get started we require the following:
- Part mechanicals
- Type of machine the plate will be used with or free-standing
APR Solder Paste Dipping Plate was added in Apr 2015
APR Solder Paste Dipping Plate has been viewed 663 times
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