APR Solder Paste Dipping Plate

APR Solder Paste Dipping Plate Description:

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a board or other device. It can also be used to dip flux of pre-bumped device.

These plates are custom-made and can be ordered to accommodate different component sizes and ball diameters.

The dipping plates can be used as stand-alone entities or be used with the tooling holes on APR rework systems.

Delivery is 2-3 days after drawing approval by the customer.

In order to get started we require the following:

1. Part mechanicals
2. Type of machine the plate will be used with or free-standing