Solder Paste Dipping Plate

Solder Paste Dipping Plate Description:

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a board or other device. It can also be used to dip flux of pre-bumped device.

These plates are custom-made and can be ordered to accommodate different component sizes and ball diameters.

The dipping plates can be used as stand-alone entities or be used with the tooling holes on PACE, SRT, AirVac, Oki or other rework systems.

Delivery is 2-3 days after drawing approval by the customer.

In order to get started we require the following:

1. Part mechanicals
2. Type of machine the plate will be used with or free-standing

At soldertools.net we supply numerous types of metal stencils including framed, frameless and prototype stencils. We show first timers how to print here  or you can see our "how to" video here. We use modern, high precision lasers to cut the finest of apertures. Our metal stencils are designed using your exact criteria with our SMT engineers providing guidance on how the stencil needs to be designed for optimal performance and release characteristics.  So, if you need a reliable service provider of stencils, with many years of experience in processing boards and performing rework, then chose BEST!