HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow
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HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow Description:
HeatShieldGel(TM)
One of the other beneficial attributes of this material is its flexibility and ease of use. Simply scoop out some of the gel material from the container. Apply it liberally to the parts requiring protection in the vicinity (not on the part being reflowed or it will not go in to reflow) Perform your rework or assembly operation. Clean the gel and surrounding area using DI water and a soft brush or run it through your wash machine cycle using a water only cleaning process. The gel is water soluble and harmless to PCBs as long as it is washed off.
It has many advantages over Kapton™ tapes or aluminum shields commonly used as heat shield materials such as:
- It is highly flexible to be used on boards with tightly-spaced components without having to do any cutting or modification
- It is the more effective than Kapton™ tape by a factor of 4X!
- It has shown to be innocuous to the PCB through thorough ionic cleanliness testing assuring you that when cleaned up properly the reliability of the board will not be impacted by using this product.
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HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow was added in Jan 2016
HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow has been viewed 1716 times
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