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cores korea


core9030b Description:

1) Non contact Coplanarity Measuring Module with Reflow Oven 2) Coplanarity measurement for lead free & Hogh Temperature environment. 3) Due to rapid growth of "Lead free solder" usage, surface mounting parts are requested to be heated higher and be stressed a lot more than before. This stress gives the so called the shape change of the part itself and it ma lead to mounting defect due to the unexpected large coplanarity after the heating, which would end up with not only the individual parts defect, but rather with total product qualith or the production control. Need to be prepared? the core9030b, new system, is solution to take!

core9030b was added in Jul 2004

core9030b has been viewed 87 times

Reflow Oven

Void Free Reflow Soldering