AuSn Solder Electroplating

AuSn Solder Electroplating Description:

AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electroplating solder technology.

Why did we develop this unique process for AuSn solder electroplating?

Hard eutectic Au-20 Sn (wt%) solder is commonly used for device packaging in optoelectronic and microelectronic industries due to its superior mechanical and thermal properties.

To reduce the size of electronic and optoelectronic parts, the packaging industry has tried to miniaturize bonding media features. This has led to the use of more delicate processes for depositing and placing solders between submounts and dies.

Providing low production costs and a firm control over thickness and composition, Micralyne’s Gold-tin (AuSn) solder electroplating process is an attractive alternative to current thin film techniques.

AuSn solder plating can be used:

• At compositions from 10 to 40 Sn (wt%)
• In conventional or patterned shapes
• On metallized substrates
• At virtually any thickness

Why should you choose Micralyne’s patented gold-tin solder plating technology?

• Save money by reducing the amount of Au used. Micralyne can electroplate AuSn solder to patterned or unpatterned substrates, eliminating the need to plate entire substrates.
• Increase production rates, save time, and reduce the risk of Sn oxidation. Micralyne uses a single solution to deposit Au and Sn together.
• Reduce manufacturing costs by eliminating the need to post-anneal the AuSn solder deposit. By controlling the current density, any composition within the range of 10 to 40 Sn (wt%)—including the commercially important 20 Sn (wt%)-can be deposited.
• Achieve greater processing flexibility. We can successfully electroplate even thick AuSn solder deposits of up to 60 μm on patterned substrates.

Using Micralyne AuSn solder electroplating gives you a very uniform thickness and composition, a smooth plating surface, and very high precision, which are major advantages for optoelectronic and microelectronic packaging applications.