MS-11 3D SPI Series
MS-11 3D SPI Series Description:
MIRTEC MS-11 3D SPI Series Presentation
► Exclusive 15MP CoaXPress Camera System
► Dual Projection Shadow Free Moiré Technology
► Precision Compound Telecentric Camera Lens
► Automated Z-Height Calibration System
► Automated PCB Under Board Support System
► Precision PCB Warpage Compensation
► Closed Loop Communication With Screen Printer
► Absolute Repeatability and Reproducibility
► INTELLISYS® Industry 4.0 Intelligent Factory Automation System
MS-11 3D SPI Series was added in Dec 2020
MS-11 3D SPI Series has been viewed 112 times
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