WS159 - Water Soluble Solder Paste
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WS159 - Water Soluble Solder Paste |
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WS159 - Water Soluble Solder Paste Description:
WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of temperatures (65-85F) and relative humidity (25-65% RH). WS159 is formulated to deliver exceptional cosmetics with easy-cleaning residues using warm water.
Attributes:
- Excellent print volume consistency with Surface Area Ratios (SAR) as low as 0.55 when used with the UltraSlic™ stencil technology
- Non-hygroscopic formulation resistant to slump and dry-out, suitable for areas with extreme humidity conditions
- Wide reflow window with excellent wetting characteristics on all surface finishes
- Enhanced tack performance and printer open time
- Low voiding/high reliability composition
- Compatible in either Nitrogen or Air reflow
Specifications:
Alloys |
SN63 (MP=183°C) |
Powder Size |
Type 3 and Type 4 Standard |
Applications |
Automatic/Manual Printing |
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WS159 - Water Soluble Solder Paste was added in Apr 2012
WS159 - Water Soluble Solder Paste has been viewed 762 times
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