Henkel Assembly Paste Adhesives

Henkel Assembly Paste Adhesives Description:

Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive dielectric materials, Henkel’s product line affords maximum performance and cost-efficiency.

Our electrically conductive and non-conductive paste adhesives are ideal for withstanding the thermal and physical stresses of Defense, Automotive, Medical and Consumer Electronic assembly applications, while our spot cure technologies enable high-speed assembly for RFID tags and other printed electronic devices. Non-conductive paste systems in the Henkel portfolio include a series of one- and two-part room temperature, thermal and UV cure adhesives for the ultimate in flexibility and performance.

For manufacturers that require both adhesive and thermal dissipation functionality, Henkel's line of thermally conductive dielectric pastes are the most trusted and reliable materials on the market. Providing outstanding adhesion and thermal performance, Henkel offers both shimmed and non-shimmed formulations. For assembly specialists that require the utmost in accuracy, our shimmed adhesives contain engineered spacers for more precise bondline control.

Henkel's Electronics Assembly Adhesive Products: